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x-ray inspection

 

x-ray c-sam

 

brief introduction:

x - ray is using a cathode ray tube to produce high energy electron striking a metal target. in the process of impact, because of the sudden slowdown of electronic, the loss of kinetic energy will be released in the form of x - ray.

 

purposes:

to test the internal cracks and defects of foreign body in metal materials and parts, plastic materials and parts, electronic components, electronic components, led components; analyze the internal displacement in bga and circuit boards; distinguish bga welding defects such as empty welding, pseudo welding; analyze the internal situation of microelectronic systems and rubber seal components, cables, fittings, plastic pieces etc.

 

applications:

ic, bga, pcb/pcba, and surface-mount technology weldability test etc.

 

reference standard:

ipc-a-610 ,gjb 548b

 

typical test images:

 

bga空洞 bga锡球开裂
bga voids bga tin ball cracking
pcb线路断开 ic缺陷检测
pcb line disconnection check the ic defect


  • contact us
  • mtt shenzhen

    tel: 400-850-4050

    fax: 0755-2782 1672

    email: marketing@mttlab.com

     

    mtt suzhou

    tel: 400-118-1002

    fax: 0512-6275 9537

    email: marketing@mttlab.com

     

    mtt shanghai

    tel: 400-118-1002

    email: marketing@mttlab.com

     

    mtt dongguan

    tel: 400-116-1002

    email:marketing@mttlab.com

shenzhen meixin testing technology co., ltd.

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