- testing
- morphology observation
- microstructure analysis
- surface element analysis
- surface foreign body
- component analysis
- mechanical property test
- thermal analysis
- welding qualification
- ct scan
- nondestructive testing
- cross section analysis
- coating thickness
- flame retardant test
- abration test
- coating quality inspection
x-ray inspection
x-ray | c-sam |
brief introduction:
x - ray is using a cathode ray tube to produce high energy electron striking a metal target. in the process of impact, because of the sudden slowdown of electronic, the loss of kinetic energy will be released in the form of x - ray.
purposes:
to test the internal cracks and defects of foreign body in metal materials and parts, plastic materials and parts, electronic components, electronic components, led components; analyze the internal displacement in bga and circuit boards; distinguish bga welding defects such as empty welding, pseudo welding; analyze the internal situation of microelectronic systems and rubber seal components, cables, fittings, plastic pieces etc.
applications:
ic, bga, pcb/pcba, and surface-mount technology weldability test etc.
reference standard:
ipc-a-610 ,gjb 548b
typical test images:
bga voids | bga tin ball cracking |
pcb line disconnection | check the ic defect |
- learn more
- qualification and honor
- contact us
- contact us
mtt shenzhen
tel: 400-850-4050
fax: 0755-2782 1672
email: marketing@mttlab.com
mtt suzhou
tel: 400-118-1002
fax: 0512-6275 9537
email: marketing@mttlab.com
mtt shanghai
tel: 400-118-1002
email: marketing@mttlab.com
mtt dongguan
tel: 400-116-1002
email:marketing@mttlab.com