- testing
- morphology observation
- microstructure analysis
- surface element analysis
- surface foreign body
- component analysis
- mechanical property test
- thermal analysis
- welding qualification
- ct scan
- nondestructive testing
- cross section analysis
- coating thickness
- flame retardant test
- abration test
- coating quality inspection
cross section of printed circuit board/assembly board
metallic/non-metallic materials | electronic component |
pcb/pcba |
purposes:
cross section can make quality judgment and preliminary analysis on the cause of the poor as well as test multi-property of printed board, such as resin contamination, coating cracks, the stratification of hole wall, solder coating, the thickness of the layers, the thickness of the coating, plating thickness, hole lateral erosion, the inner ring width, coincidence degree between the layers, the coating quality, the hole wall roughness, etc. through the printed circuit board micro cutting technology obtained micro-section can be used to check the pcb internal wire thickness, layer number, hole aperture size, hole quality observation, pcba solder inner cavity, interface combination status, wetting quality evaluation etc.
applications:
pcb/pcba, integrated circuits, etc
test flow:
take samples→cleaning→vacuum mosaic→grinding→polishing→observe
reference standard:
ipc-tm 650 2.1.1 , ipc-tm 650-2.2.5, ipc a 600, ipc a 610 etc.
typical test images:
bga solder ball empty solder | |
cpu solder ball empty solder | pth internal void |
pcb copper layer thickness | pcb inner structure cracking |
- learn more
- qualification and honor
- contact us
- contact us
mtt shenzhen
tel: 400-850-4050
fax: 0755-2782 1672
email: marketing@mttlab.com
mtt suzhou
tel: 400-118-1002
fax: 0512-6275 9537
email: marketing@mttlab.com
mtt shanghai
tel: 400-118-1002
email: marketing@mttlab.com
mtt dongguan
tel: 400-116-1002
email:marketing@mttlab.com