- testing
- morphology observation
- microstructure analysis
- surface element analysis
- surface foreign body
- component analysis
- mechanical property test
- thermal analysis
- welding qualification
- ct scan
- nondestructive testing
- cross section analysis
- coating thickness
- flame retardant test
- abration test
- coating quality inspection
electronic component section analysis
metallic/non-metallic materials | electronic component |
pcb/pcba |
purposes:
with the development of technology and process, electronic products is more and more miniaturization, complication and systematization, and its function is more and more powerful, integration is more and more high, the volume becomes smaller and smaller. cross section analysis is with the aid of slice analysis technology and the high rate of microscope to confirm the electronic components failure phenomena, analysis process, raw material defect.
applications:
electronic components, communications, electronics, led, sensors, etc
test flow:
take samples→cleaning→vacuum mosaic→grinding→polishing→observe
reference standard:
ipc-tm 650 2.1.1 , ipc-tm 650-2.2.5 etc.
typical test images:
led the second binding point | |
ceramic capacitor poor welding | internal structure crack of ceramic capacitor |
- learn more
- qualification and honor
- contact us
- contact us
mtt shenzhen
tel: 400-850-4050
fax: 0755-2782 1672
email: marketing@mttlab.com
mtt suzhou
tel: 400-118-1002
fax: 0512-6275 9537
email: marketing@mttlab.com
mtt shanghai
tel: 400-118-1002
email: marketing@mttlab.com
mtt dongguan
tel: 400-116-1002
email:marketing@mttlab.com