- testing
- morphology observation
- microstructure analysis
- surface element analysis
- surface foreign body
- component analysis
- mechanical property test
- thermal analysis
- welding qualification
- ct scan
- nondestructive testing
- cross section analysis
- coating thickness
- flame retardant test
- abration test
- coating quality inspection
nondestructive testing (electronic products & components)
x-ray | c-sam |
brief introduction:
nondestructive testing refers to the method makes use of internal structure abnormalities or defects causing the change of heat, sound, light, electricity, magnetic, etc to inspect and test the specimen surface and internal structure, properties, status and defect types, quantity, size, shape, position under under the premise of without harming the use performance and internal organization of detected objects. by measuring these changes to understand and evaluate the detected materials, and the nature of the device components, status, quality or internal structure etc.
applications
cars, pcb & pcba, fpc, electronic appliances, electronics components, plastic materials, metal materials, medical equipment, research institutes, aerospace, military and defense etc.
sample requirements:
x-ray: not more than 300mmx300mm
c-sam: no specific requirements
ct: general requirements for sample size no greater than 50mmx50mm.
- learn more
- qualification and honor
- contact us
- contact us
mtt shenzhen
tel: 400-850-4050
fax: 0755-2782 1672
email: marketing@mttlab.com
mtt suzhou
tel: 400-118-1002
fax: 0512-6275 9537
email: marketing@mttlab.com
mtt shanghai
tel: 400-118-1002
email: marketing@mttlab.com
mtt dongguan
tel: 400-116-1002
email:marketing@mttlab.com